Reflow Shuttle – Advanced Reflow Oven Verification

The SolderStar Reflow Shuttle – O2 gives manufacturers a powerful, repeatable way to verify and optimise their reflow soldering process. By combining temperature profiling with advanced measurements such as oxygen PPM, vibration, and vacuum performance, it provides the detailed insight needed to maintain a stable, high‑quality reflow environment.

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Reflow Shuttle – Advanced Reflow Oven Verification

A Complete Measurement Platform for Reflow Verification

The Reflow Shuttle – O2 integrates multiple sensing technologies into a single, production‑ready fixture. Each slide below highlights a key part of how the system captures and analyses reflow performance.

Smartlink‑Enabled Measurement Shuttle

Each shuttle features the Smartlink system for fast, secure connection to the SLX datalogger. This allows advanced parameters to be captured alongside standard temperature profiles in one streamlined process.

Zone‑by‑Zone Oxygen Analysis

The O2 module measures oxygen levels throughout the oven, pinpointing nitrogen leakage and revealing how oxygen PPM varies across each heated zone.

Multi‑Point Temperature Profiling

Arrays of Type‑K sensors measure top and bottom heater performance, while matched sensors at the front of the shuttle verify temperature uniformity across the width of each zone.

Vibration & Vacuum Performance Tracking

Built‑in sensors capture 3‑axis conveyor vibration, and optional modules measure vacuum levels down to 10 mbar — all displayed alongside the temperature profile for complete process understanding.

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Features

The Reflow Shuttle – O2 focuses on the advanced measurements required for today’s high‑performance reflow soldering applications.

The O2 module provides zone‑by‑zone oxygen analysis, helping engineers identify nitrogen leakage and maintain controlled reflow atmospheres.

Explore the Solderstar Reflow Shuttle - O2

Comprehensive Reflow Process Insight

The Reflow Shuttle – O2 provides a complete set of measurements needed to understand and optimise modern reflow soldering. By capturing oxygen levels, vibration, vacuum performance, and temperature profiles in a single run, it gives engineers the data required to maintain a stable and repeatable process.

Precision Temperature and Atmosphere Control

With arrays of Type‑K sensors and matched cross‑zone probes, the shuttle verifies heater performance and thermal uniformity with high accuracy. The O2 module adds detailed oxygen PPM tracking, allowing manufacturers to quickly identify nitrogen leakage and maintain controlled reflow atmospheres.

Machine Health and Vacuum Performance Monitoring

3‑axis vibration measurement helps engineers detect mechanical issues early, from fan imbalance to conveyor wear. For vacuum‑assisted reflow, the optional vacuum module captures detailed vacuum profiles, ensuring correct pull‑down, hold, and release behaviour to prevent component movement.