Thermal Profiling Innovation
A single profiling Datalogger. Multiple soldering processes. Unmatched accuracy.
Designed for precision manufacturing teams, Solderstar’s thermal profiling solutions deliver repeatable, high-accuracy data across reflow, wave and vapour phase soldering - helping you reduce downtime, defects and operational cost.
The Solderstar Difference. Real-world savings through interchangeable and expandable design.
By using a single data logger across multiple processes, Solderstar helps manufacturers eliminate delays, reduce calibration costs, maintenance cycles and keep production moving.
Used by Precision Manufacturers Worldwide
One Platform. Three Solutions.
Solderstar delivers a unified profiling ecosystem designed to support every major soldering process with ease and consistency. Built around a flexible, user‑friendly system that adapts effortlessly to reflow, wave, and selective soldering, it gives manufacturers the freedom to manage all their thermal profiling needs from one powerful platform. Whether you’re fine‑tuning a complex production line or validating a new process, the technology works seamlessly across applications—reducing setup time, simplifying workflows, and ensuring reliable, repeatable results. With intuitive operation and the versatility to handle any soldering challenge, Solderstar provides a complete solution that grows with your production demands.
Built for High-Reliability Industries
Solderstar’s profiling technology is engineered to meet the stringent demands of industries where precision, consistency, and full process accountability are essential. From aerospace and automotive, to defence and other advanced manufacturing sectors, the platform delivers the robust performance and dependable data required to maintain compliance and ensure product integrity. Its adaptable design supports complex production environments, while intuitive tools help teams validate processes, document results, and uphold the highest levels of quality assurance. For organisations operating in demanding, safety‑critical markets, Solderstar provides the confidence and clarity needed to keep every process under control.
Global Reach. Industry Expertise.
With a presence across key manufacturing regions and decades of process‑control experience, Solderstar supports customers worldwide with solutions tailored to the demands of modern production. Our technology is trusted by leading organisations across aerospace, automotive, defence, and advanced electronics, delivering the insight and reliability needed to maintain consistent quality at scale. Wherever your operations are based, Solderstar provides the expertise, tools, and support to keep your processes performing at their best.
Supporting the industries we serve
Solderstar are committed to industry participation, and are members of Electronics Industry groups. We regularly exhibit at major electronics trade events,along with supporting our distributor events.
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Read the latest Technical Articles
See all Technical ArticlesWhat’s Really Happening InsideYour Vacuum Chamber? – Global SMT Packaging EMT
In this Global SMT & Packaging feature, Bastian Sulinski examines how vacuum reflow technology is reshaping expectations around solder‑joint quality and process control. As assemblies become denser and more thermally complex, the article highlights why temperature‑only profiling can no longer validate the performance of modern vacuum stages. The piece explores the growing need for integrated thermal‑and‑pressure measurement: capturing pulldown behaviour, hold stability and release characteristics - to ensure consistent void reduction in high‑reliability production. The result is a detailed look at how manufacturers can move beyond assumptions and gain true visibility into vacuum performance, strengthening repeatability and meeting the increasingly demanding standards of advanced electronics manufacturing.
Process verification in aerospace electronics manufacturing – EFE Magazine
In this Electronics for Engineers feature, Chris Williams examines how aerospace electronics manufacturing is redefining expectations around process verification. As mission‑critical PCBs become more compact and thermally diverse, the article highlights why temperature‑only profiling is no longer sufficient for ensuring stable, repeatable soldering performance...
Rethinking process verification – EPP Europe
In this EPP Europe feature, Chris Williams of Solderstar examines how modern electronics manufacturing is reshaping expectations around process verification. As assemblies grow denser and thermal behaviour becomes more unpredictable, the article explores why traditional temperature‑only profiling can no longer guarantee stable, repeatable soldering performance...
Temperature Profiling is Not Enough for Modern Reflow Soldering – US Tech
In this US Tech special feature, Technical Director Patrick McWiggin examines why modern reflow soldering demands far more than traditional temperature profiling. As today’s electronics become smaller, more complex, and more reliability‑critical, the article explores how oxygen control, vacuum behaviour, vibration monitoring, and conveyor performance now shape solder quality just as much as thermal accuracy...
Advances in Thermal Profiling of Reflow Soldering – EPDT
In this in‑depth feature, Chris Williams explores how rapid advances in thermal profiling are reshaping the standards of modern reflow soldering. As electronic assemblies become smaller, denser and more thermally demanding, the article highlights the technologies now enabling manufacturers to achieve far greater precision and visibility in their soldering processes...
Take Control of Your Thermal Processes
Discover industry‑leading profiling tools designed for accuracy, efficiency, and complete process confidence.