Solderstar at SMTA International 2026

Solderstar is gearing up for another standout year at SMTA International 2026, where we’ll be showcasing our latest advancements in thermal profiling and process verification. The exhibition is always a prime opportunity for engineers, process specialists and manufacturing leaders to bring their toughest challenges to the table – and this year, we’re coming prepared with powerful new tools designed to solve them.

At Booth 2624, visitors will be able to explore hands‑on demonstrations of our newest profiling technologies, including the SLX profiling platform, SLX‑OP oxygen profiling system, and our expanding suite of vacuum reflow verification tools. These systems are built to help manufacturers tackle the real‑world issues we hear about every day such as: inconsistent reflow performance, voiding challenges, nitrogen consumption, conveyor instability, vibration‑induced defects and the increasing complexity of mixed‑technology assemblies.