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Thermal Profiling Solutions

Solderstar’s Thermal Profiling Solutions give you fast, accurate insight into your soldering process, helping you optimise performance and maintain consistent quality.

Reflow Profiling

Explore solutions that track and optimise temperature changes throughout the reflow process for flawless component soldering.

Vapor Profiling

Discover tools designed to monitor and fine-tune the temperature and timing of Vapour phase soldering for superior solder joint quality.

Process Verification

Find solutions that deliver precise, repeatable control across your soldering process, ensuring stable conditions and reliable joints.

Profiling Software That Turns Data into Control

Probably the most important part of a profiling system is its software. The software allows process data to be captured, stored, organised and analysed to determine the current process state. Modern profiling software offers much more than this though, incorporating sophisticated process recipe search engines which allow a process to be optimised for maximum quality and throughput. SPC tools allow engineers to track process stability and warn when corrective action needs to be taken Solderstar software has a modern look and feel. Important data is displayed in an easy-to-understand form that Process Operatives and Engineers alike feel comfortable with.
Explore our software

A Unified Platform, Not Isolated Products.

Solderstar’s integrated platform brings the SLX datalogger, process‑specific hardware, and advanced analysis software together in one streamlined system, giving manufacturers a seamless workflow from data capture to insight. With everything designed to work as a single environment, it removes compatibility headaches, speeds up decision‑making, reduces operator training to virtually zero, and delivers consistent, standardised process control across every production line.
Solderstar's R-0625-SLX 6 Channel Reflow Profiler

Read the latest Technical Articles

See all Technical Articles

What’s Really Happening InsideYour Vacuum Chamber? – Global SMT Packaging EMT

In this Global SMT & Packaging feature, Bastian Sulinski examines how vacuum reflow technology is reshaping expectations around solder‑joint quality and process control. As assemblies become denser and more thermally complex, the article highlights why temperature‑only profiling can no longer validate the performance of modern vacuum stages. The piece explores the growing need for integrated thermal‑and‑pressure measurement: capturing pulldown behaviour, hold stability and release characteristics - to ensure consistent void reduction in high‑reliability production. The result is a detailed look at how manufacturers can move beyond assumptions and gain true visibility into vacuum performance, strengthening repeatability and meeting the increasingly demanding standards of advanced electronics manufacturing.

View PDF of What’s Really Happening InsideYour Vacuum Chamber? – Global SMT Packaging EMT

Process verification in aerospace electronics manufacturing – EFE Magazine

In this Electronics for Engineers feature, Chris Williams examines how aerospace electronics manufacturing is redefining expectations around process verification. As mission‑critical PCBs become more compact and thermally diverse, the article highlights why temperature‑only profiling is no longer sufficient for ensuring stable, repeatable soldering performance...

View PDF of Process verification in aerospace electronics manufacturing – EFE Magazine

Temperature Profiling is Not Enough for Modern Reflow Soldering – US Tech

In this US Tech special feature, Technical Director Patrick McWiggin examines why modern reflow soldering demands far more than traditional temperature profiling. As today’s electronics become smaller, more complex, and more reliability‑critical, the article explores how oxygen control, vacuum behaviour, vibration monitoring, and conveyor performance now shape solder quality just as much as thermal accuracy...

View PDF of Temperature Profiling is Not Enough for Modern Reflow Soldering – US Tech

Advances in Thermal Profiling of Reflow Soldering – EPDT

In this in‑depth feature, Chris Williams explores how rapid advances in thermal profiling are reshaping the standards of modern reflow soldering. As electronic assemblies become smaller, denser and more thermally demanding, the article highlights the technologies now enabling manufacturers to achieve far greater precision and visibility in their soldering processes...

View PDF of Advances in Thermal Profiling of Reflow Soldering – EPDT

Precision Soldering Starts Here

Engineered for performance and built for trust, our soldering technologies support the demands of modern manufacturing.