Process Verification Software & SPC
Solderstar Process Verification Software & SPC provides manufacturers with a complete toolkit for analysing, verifying, and controlling every key parameter within soldering and reflow processes. Designed for precision and repeatability, it integrates advanced measurement modules and intelligent fixtures to deliver real‑time insight into machine performance and process stability.
Temperature Measuring Profile
The Temperature Measuring Profile tools give engineers a clear visual understanding of how heat behaves throughout the soldering process. The software displays temperature curves, zone‑to‑zone behaviour, and top/bottom heating balance, making it easy to confirm whether the process is stable and within expected limits. Users can quickly compare runs, check for drift, and validate that the thermal profile remains consistent over time.
Vacuum Temperature
Vacuum Temperature analysis combines temperature and vacuum data into a single, easy‑to‑read software view. The system automatically calculates vacuum hold time, pull‑down rate, and release rate, then overlays these values with the temperature profile. This helps users understand how the vacuum stage influences void reduction and ensures the process behaves consistently from run to run.
Vibration
The Vibration module provides a three‑axis software view of machine stability, highlighting any changes in mechanical behaviour that could affect soldering performance. The software plots X, Y and Z vibration levels over time, making it simple to spot trends, harmonics, or sudden shifts caused by conveyor issues, fan speed changes, or extraction problems. This gives engineers a fast, data‑driven way to confirm that the machine is running smoothly.
SPC Reporting
Process trends can be monitored and process yields and quality can be improved through continuous SPC. Using SPC Manager, users can evaluate process trends for profiles selected from the database, illustrating these on professional Xbar and Range charts that include Cp, Cpk and control limits. Charts can be output in hard copy or digital format.
O₂ Measurement and Analysis
The O₂ Measurement and Analysis tools provide a full software‑based view of oxygen levels throughout nitrogen‑controlled reflow processes. Oxygen PPM is tracked zone by zone and displayed alongside temperature and process timing, helping users identify nitrogen leaks, flux build‑up, or uneven inerting conditions.
The software highlights changes in oxygen levels as the product moves through the oven, making it easy to optimise nitrogen usage and maintain ideal process conditions. Combined with SPC tools, long‑term oxygen trends can be monitored to ensure every zone stays within specification and supports consistent solder joint quality.
