Vacuum Reflow Carrier
The Solderstar Vacuum Reflow Carrier ensures both the SLX profiler and the PCB under test travel together through the heated zones and into the vacuum chamber while the vacuum is applied, enabling accurate, aligned thermal and vacuum profiling.
Engineered for Accurate Vacuum‑Stage Profiling
A controlled carrier system that captures both temperature and vacuum behaviour in a single run.
Features
Capture both thermal and pressure behaviour in one pass.
Measure vacuum levels down to 10 mbar for precise process control.
Automatically calculate vacuum dynamics to prevent component movement.
Confirm the assembly remains below the target vacuum level for the required duration.
Securely holds different board sizes and sensor layouts.
Fast connection to SLX profilers for streamlined setup.
Define vacuum‑stage position to ensure correct overlay of all profile data.
Designed to simplify profiling inside vacuum‑assisted reflow systems.
The Vacuum Reflow Carrier provides a stable, repeatable platform for transporting both the SLX profiler and the PCB through the heated zones and into the vacuum chamber. Its integrated sensing, adjustable fixture and cable‑management system ensure clean, reliable data capture even under rapid pressure changes. This makes it ideal for process setup, verification and ongoing quality control in any vacuum‑equipped reflow line.